The team led by Professor Martin Cubal of the Center for Thermal and Instrument Reliability (CDTR) found that by producing an ultra pure version of boron nitride, the potential for thermal conductivity was
550 W / mk twice as high as copper.
Article: Modulation of thermal conductivity in hexagonal boron nitride by controlled borisotope concentrations was published today in Communication Physics. Most of the semiconductor electronics heat up when used, and the warmer they are, the faster they collapse and their performance decreases as we count more and more on our electronic devices. It is important to find materials with high thermal conductivity that can waste heat.
Boron nitride is one of the ingredients that is expected to have 550 W / mK twice the thermal conductivity of copper, but all measurements show that its thermal conductivity is much lower for the first time we have proven the potential for very high heat transfer.
Professor Cubal said the next step was the production of active boron nitride electronic devices and integration with other semiconductor materials.